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Bergquist GapFiller1500双组分液态间隙填充导热材料
材料生产商：美国贝格斯（BERGQUIST）公司研发产品
GapFiller1500可供规格：
规格(Specifications):50CC、400CC、1200CC、10galon
导热系数(Thermal Conductivity)：1.8W/m-k
基材(Reinfrcement Carrier)：硅胶
胶面(Glue)：无
颜色(Color)：黄色/白色
包装(Pack)：美国原装进口包装
持续使用温度（Continous Use Temp）：-60°~175°
密度（Density）:2.7g/cc
GapFiller1500应用材料特性：
很好的剪切变稀特性（可以很大的提高点胶的速度和设备的可靠性），高抗流挂性，良好的型状保持性能，很好贴服性，针对易碎和低压力应用设计，100%固体-没有固化副产品
GapFiller1500应用：
汽车电子，电脑和周边，通讯，导热防震，在任何产生热量的半导体和散热器之间
GapFiller1500技术优势分析：
GapFiller1500导热固体胶是双分组包装，在使用时需要使用相应的胶枪。胶枪根据导热固体胶的容量大小而定。其比例为1:1 所以其A组与B组的容量对等。
Gap Filler 1500 is
a two-part, high performance, thermally conductive liquid gap filling material,
which features superior slump resistance and high shear thinningcharacteristics
for optimized consistency and control during dispensing.The mixed system will
cure at room temperature and can be accelerated with the addition of heat.
Unlike cured thermal pad materials, a liquid approach offers infinite thickness
variations with little or no stress to the sensitive components during assembly.
Gap Filler 1500 exhibits low level natural tack characteristics and is intended
for use in applications where a strong structural bond is not required. As
cured, Gap Filler 1500 provides a soft, thermally conductive, form-inplace elastomer
that is ideal for fragile assemblies and filling unique and intricate air voids
and gaps.
